Presenting at IPC APEX EXPO 2016 in Las Vegas will provide significant visibility for you and your organization. Thousands of individuals will receive the technical proceedings from this event, ensuring that your material will be seen by key managers and executives from all segments of the worldwide electronics industry. Presenting a technical conference paper or teaching a professional development course is a unique and cost-effective channel to promote your expertise and your organization to your customers and prospects.
Submissions are being sought on design, materials, assembly, processes and equipment in areas such as adhesives, advanced technology, assembly and rework processes, automation in electronics manufacturing, packaging, business and supply chain issues, cleaning, conformal coatings,counterfeit electronics, electronics manufacturing services, flexible circuitry, HDI technologies, PCB fabrication, photovoltaics, PoP (Package-on-Package), printed electronics, reshoring, RFID circuitry, robotics, soldering, surface finishes, test, inspection and AOI, and tin whiskers, among others.
To submit the abstracts, visit www.IPCAPEXEXPO.org/CFPapers. For more information, contact Jasbir Bath at JasbirBath@ipc.org, or Toya Richardson at ToyaRichardson@ipc.org.
Abstracts are due August 14; and acceptance by September 4. Papers are due November 13, while presentations due December 11.
Tags: PCB manufacturer, PCB supplier, PCB assembly, PCB design, Multilayer PCB, HDI PCB, LED PCB, Automotive PCB, High Frequency PCB. Industry Control PCB, PCBA, PCB Samples.