Orbotech Ltd. announced today that it has received orders totaling $31 million for a variety of solutions from a leading Japanese electronics components manufacturer. The manufacturer, a long-time Orbotech partner with facilities located worldwide, selected Orbotech’s Direct Imaging (DI), Inkjet and Automated Optical Inspection (AOI) PCB production solutions, as part of its program to expand the capacity of its multilayer flex component manufacturing lines for organic material components of the latest generation of smartphones.
“We have seen consistent growth in our smartphone business in both volume and in increasingly advanced features,” said the VP of the Manufacturing and Engineering Unit of the leading Japanese electronics components manufacturer. “As the processes supporting these features become more complex, Orbotech’s advanced technologies help us to keep our competitive advantage while expanding our capacity.”
“We are proud to enable our customers to maintain their technological edge with our advanced solutions,” said Yair Alcobi, President of Orbotech PCB South East Asia. “Our close collaborations with leading manufacturers worldwide allow us to develop solutions that improve our customers’ capabilities and enable the industry to move forward.”
Solutions ordered include the Paragon Ultra, delivering superior Direct Imaging (DI) accuracy and yields for the industry’s most complex IC substrates, and the Nuvogo 1000 for large-format DI, enabling consistent high-quality DI for both patterning and solder mask at unmatched throughput and quality. The deal also included Sprint 200 Flex for inkjet printing and the Ultra Fusion 200 AOI (Automated Optical Inspection) solution. Delivery of all orders is expected to be completed in 2018.