Ventec International is adding to its extensive thermally conductive laminate and pre-preg range with the launch of the VT-5A2, a next-generation best-in-class, high Tg thin-core and pre-preg material.
VT-5A2 is designed for the world's most thermally demanding printed circuit board (PCB) applications such as power converters, hybrid multilayers and high-power electronics with heavy copper designs, providing enhanced signal stability in harsh environments. With VT-5A2, Ventec has created its highest-performance thermally conductive laminate material so far, with a polymer matrix that is fully compatible with Ventec laminates, epoxy or polyimide-based materials including tec-speed®, thus allowing total compatibility in the manufacture of hybrid multilayer boards.
With a thermal conductivity eight times that of FR-4, VT-5A2 delivers class-leading thermal performance and high flowability for perfect encapsulation, allowing for better board design for applications requiring critical thermal management in harsh environments. Customers can choose between thin core and pre-preg variants. VT-5A2 features a thermal conductivity of 2.2 W/m.K, a high Tg of 190°C, best-in-class thermal performance (T260 >60 Minutes, T288 >30 Minutes and T300 >15 Minutes) and M.O.T. up to 150°C. VT-5A2 is lead-free assembly compatible, fulfills RoHS and WEEE requirements and complies with UL94 V0.
The VT-5A2 thermally conductive laminate is manufactured by Ventec using strict quality controlled processes that are certified to AS9100 Revision C, ISO/TS16949 and ISO 9001:2015, and, like all Ventec products, is backed by a fully controlled and managed global supply chain, sales and support network.
Tags: HDI PCB, Rigid-Flex PCB, FPC, Aluminum Base PCB, Heavy Copper PCB, Hybird Lamination PCB, Multilayer PCB, Rigid PCB.