Advanced Copper Foil has secured an international patent for Poly-Supported Copper Foil, promoted under the name ACF-Screen. This patent is non-Provisional under International Application number PCT/050938.
ACF-Screen is comprised of a proprietary protective Poly Release film, which is adhered to sheets of ultra-thin copper foil in a cleanroom environment. This product provides complete protection of the copper surface throughout the entire cycle of PCB layup and lamination. ACF-Screen utilizes an inert adhesive which results in a guaranteed residue-free copper surface during subsequent processing. The release film will withstand temperatures of the lamination cycle, allowing for easy removal during break-down. ACF-Screen will eliminate anomalies caused by bending or creasing of copper foils during handling, while always completely protecting the surface from foreign materials and contamination. This product is available on copper foils from 5 μm, 9 μm to 70 μm. ACF-Screen is available on Standard, VLP, HVLP and ANP (Almost No Profile) copper foils.
“This product is going to revolutionize the industry. It will ease the handling of copper foils compared to loose foils, resulting in more efficient and speedier layup process,” says Shane Stewart, Product Manager.
ACF will be showcasing this product at the IPC APEX show in San Diego on February 14-16. Drop by the booth (#3701) for more information and to request samples of this new revolutionary product.