Oliver Chan, CEO of Flytop Circuit Limited, has announced that his company recently enhanced their Via Fill capabilities with the installation of a MASS VHF300 Horizontal Hole Filling system with full chamber vacuum capability, accompanied by a MASS ES10 double sided Scavenger unit.
This unit gives Flytop the capability of doing both conductive and non-conductive via fill including the ability to plug high aspect ratio holes and blind vias.
“The demand for via fill in terms of technology and volume requirements has steadily been increasing. It was essential that we upgrade our existing processes in order to better fulfill the growing requirements of our customers for higher technology. We put a great deal of focus on making sure all our customers’ needs, both present and future, are met so we have invested over two million dollars in the past 18 months on new and vital equipment acquisitions to do just that and we’re just getting started. Our plan is to be one of the leading high tech PCB fabricators in China,” stated Mr. Chan when making the announcement.
About Flytop Circuit Limited
Flytop Circuit Limited prides itself on being a total solutions provider, manufacturing quality rigid, metal-backed, RF/Microwave, flex and rigid-flex PCBs for the medical, automotive, industrial, defense, and aerospace markets in volumes from test and prototypes to large production orders. Flytop has the expertise to provide a wide variety of technologies in a time-critical environment. Their qualifications include ISO 9001:2008, TS16949, ISO14001. Flytop also holds a number of key patents for metal bonding processes. For more information about Flytop services or to ask one of their technology experts a question,please contact us by info@flytoptech.com.