The study examines the use of reballing lead-free assemblies in order to meet high-reliability requirements, and it estimates the average costs that this workaround typically adds to board production. In addition, the study also assesses the price differential of scarce components and identifies many types of components that survey respondents categorize as scarce or unavailable in leaded versions.
The report also uncovered tipping points at which the industry can be expected to go fully lead free. These tipping points and other indicators are the basis for a 10-year forecast of the ratio of tin/lead to lead-free solder consumption, both worldwide and in North America.
The growing cost differential between leaded and unleaded materials and components will eventually force a shift to lead-free electronics in high-reliability applications. The study provides a look at how manufacturers are coping with these problems today and how this trend will affect the industry in the future.
Tags: high-reliability applications, lead-free assemblies, PCB assembly, PCB production, PCB in Military and Aerospace Applications.