Orbotech Ltd., a leading global supplier of yield-enhancing and process-enabling solutions for the manufacture of electronics products, is demonstrating a wide selection of its newest, most innovative, mass production PCB manufacturing solutions for mSAP (modified semi-additive process), advanced HDI and flexible printed circuits at the 2017 JPCA show, June 7-9 in Tokyo Japan.
Among the mSAP enabling innovations Orbotech is presenting at the show are the Orbotech Ultra Fusion 300 AOI solution which now offers new 2D Metrology In-Process Quality Control (IPQC). The company is also demonstrating its Precise 800, the only one-stop AOS solution for opens, nicks & shorts, and Nuvogo Fine 10 DI solution for mSAP, advanced HDI, flexible and rigid PCB patterning. Additionally, the Sprint 200 Flex digital legend inkjet printing solution, optimized for flex multi-panel PCB production, is being shown at the Orbotech booth.
The company is showcasing Orbotech Smart Factory for Industry 4.0 compliant, integrated PCB production. Orbotech Smart Factory, which connects to all Orbotech products, enables real-time production analysis, bi-directional communication and data sharing, enabling traceability and on-demand data analysis. In addition, Orbotech is presenting InCAM Flex, InPlan Flex, InSight PCB, InStack Design and InStack Viewer and its CAM and engineering software solutions for the smart factory.
As a part of the JPCA show’s NPI (New Product Introduction) Seminar, Mr. Kimura Yasushi, Orbotech’s Vice President of Marketing & Products for Japanese Global Accounts will present a session on its Orbotech Smart Factory™ for Industry 4.0. During the seminar, Mr. Yasushi will explain how the new Orbotech Smart Factory solution is truly a partner for Industry 4.0. By self-analyzing and predicting failures and by enabling real-time production analysis, bi-directional communication and traceability, Orbotech Smart Factory helps manufacturers to optimize productivity and responsiveness to production issues.
“Orbotech is proud of our close customer relationships in Asia and of how we continuously work together to deliver leading, accurate solutions for flexible and rigid PCB mass production that help our customers to stay at the forefront of PCB manufacturing,” commented Mr. Yair Alcobi, President of Orbotech Asia East. “The great deal of interest that this market shows in our mSAP solutions and in Orbotech Smart Factory solution is testament to the need for reliable solutions that can significantly improve production processes.”
About Nuvogo Fine 10: Nuvogo Fine 10 is a member of Orbotech’s industry-leading Direct Imaging (DI) solutions for the solutions for the mSAP, advanced HDI & FPC PCB markets. Providing total synergy between Orbotech’s state-of-the-art optics, mechanics and electronics, Nuvogo Fine offers fine resolution (L/S=10/15μm) with superior imaging quality and exceptional throughput. Nuvogo Fine incorporates Orbotech’s field-proven Large Scan Optics (LSO) Technology™, delivering exceptionally high Depth-of-Focus (DoF), and imaging uniformity. It is powered by MultiWave Laser Technology™ which provides optimal resist flexibility.
About Precise 800
The groundbreaking Precise 800 is the first and only ‘one-stop’ Automated Optical Shaping (AOS) solution for mSAP, advanced HDI and complex multi-layer PCB manufacturing market, capable of both ablating excess copper (“shorts”) and depositing missing copper (“opens” and “nicks”), all in a single automated process. Enabling accurate, high quality 3D shaping of the most advanced PCB designs, the Precise 800 significantly increases yield by virtually eliminating PCB scrap. The Precise 800 addresses all defects including those on inner and outer layers, multiple lines, corners and pads.
About Ultra Fusion 300+ 2D Metrology
Ultra Fusion 300 is an mSAP and advanced HDI AOI solution, which is a part of the Orbotech market-leading, high performance AOI family, based on the Multi-Image Technology for superior detection and false-alarm reduction. Orbotech’s Ultra Fusion 300 can now be further enhanced with automated 2D Metrology IPQC (In-process Quality Control), enabling continuous automatic inline measurement of both top and bottom conductor widths, ensuring accurate and repeatable measurements results with fast and simple sampling and advanced traceability.
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