MacDermid Enthone Electronics Solutions will present at the SMTA South East Asia Technical Conference on Electronics Assembly being held in Penang, Malaysia, March 28-30, 2017.
Economical methods for thermal management of high density circuitry has become critically important as more powerful heat-generating IC and LED substrates are packaged on increasingly small HDI interconnect constructions. Rich Bellemare, Metallization Applications Manager, will discuss various methods of transferring heat away from sensitive components, including direct attachment of heat sinks, metal core printed circuits boards, conductive paste filled vias, and electroplated thermal vias. Rich will present his paper “The Effects of Board Design on Electroplated Copper Filled Thermal Vias for Heat Management“ on Wednesday March 29 at 4:30pm. This paper will discuss the use of copper filled thermal vias utilizing a two step electroplating process as a means of heat dissipation to improve product performance, efficiency, and life.
The SMTA is a global association with a membership at a local level and is comprised of international professionals who build skills, share practical experiences, and develop solutions through best practices and real world solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
Tags: HDI PCB, Rigid-Flex PCB, FPC, Aluminum Base PCB, Heavy Copper PCB, Hybird Lamination PCB, Rigid Multilayer PCB, High Frequency PCB.