At IPC this week, Orbotech is exhibiting its new Nuvogo 1000 Direct Imaging (DI) system for the PCB manufacturing process. At the show, Orbotech is also presenting, Automated Optical Shaping (AOS) technology.
Orbotech Nuvogo 1000 DI solution brings high accuracy and fast throughput to demanding designs for patterning, solder mask and flex solder mask applications. Utilizing a high-power laser and Orbotech’s unique MultiWave Laser Technology™, the Nuvogo 1000 delivers optimized structures, small undercut and excellent side walls. The high depth-of-focus achieved by field-proven Orbotech Large Scan Optics (LSO) technology ensures unmatched quality on the most challenging surface topographies. The system also offers advanced scaling modes for high precision registration, and a dual table mechanism to optimize imaging time and maximize throughput.
Consistently developing new technologies to improve processes and reduce costs, Orbotech will demonstrate Automated Optical Shaping technology which completes patterns where copper is missing with high precision. This technology, intended to be included in future Orbotech solutions, complements Orbotech’s revolutionary CLS (Closed Loop Shaping) which allows for the accurate removal of excess copper without damaging the laminate.
“The new Nuvogo 1000 DI is another testament to Orbotech’s commitment to bring innovative technologies and cost-effective, high-quality solutions to PCB manufacturers,” said Hadar Himmelman, Orbotech West President. “Furthermore, we believe that our planned AOS technology will soon enable manufacturers to address all defects even in the most advanced PCB designs and to practically eliminate scrap.”